Springer US Wafer Level 3-D ICs Process Technology
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Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ?ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today’s trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ?ows, and functional diversi?cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren’t vertically stacked strata endemic to the semiconductor industry? The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.
EAN: 9780387765341
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Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ?ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today’s trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ?ows, and functional diversi?cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren’t vertically stacked strata endemic to the semiconductor industry? The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.
EAN: 9780387765341
Versandkosten: 0 EUR
Verfügbarkeit: in stock
Lieferzeit: 3 bis 5 Werktage
Zustand: new
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Springer Nature Singapore Metal Micro-Droplet Based 3D Printing Technology
181.89 EUR
This book introduces a unique 3D printing method that prints metal parts by ejecting metal micro-droplets: a low-cost, contactless, and environmentally friendly 3D printing technology. This book follows a deductive approach to describe the fundamentals of metal droplet-based 3D printing and reveal the relationships and unique features among multiple specific techniques used in droplet-based 3D printing. It starts with a general description of the principles and techniques involved in this technology and then focuses on the details of several specific metal droplet-ejection methods. Next, it puts forward various specific 3D printing techniques and illustrates their applications. This book is a valuable reference for scholars and researchers who work on metal 3D printing and other related areas. It is also used as a textbook for college graduate courses in mechanical manufacturing and material processing.
Springer Nature Singapore Advances in 3D Image and Graphics Representation, Analysis, Computing and Information Technology
213.99 EUR
This book gathers selected papers presented at the conference “Advances in 3D Image and Graphics Representation, Analysis, Computing and Information Technology,” one of the first initiatives devoted to the problems of 3D imaging in all contemporary scientific and application areas. The aim of the conference was to establish a platform for experts to combine their efforts and share their ideas in the related areas in order to promote and accelerate future development. This second volume discusses algorithms and applications, focusing mainly on the following topics: 3D printing technologies; naked, dynamic and auxiliary 3D displays; VR/AR/MR devices; VR camera technologies; microprocessors for 3D data processing; advanced 3D computing systems; 3D data-storage technologies; 3D data networks and technologies; 3D data intelligent processing; 3D data cryptography and security; 3D visual quality estimation and measurement; and 3D decision support and information systems.
Springer Nature Singapore Polymer 3D Printing and 3D Copying Technology
160.49 EUR
This book focuses on 3D printing and molding/ copying technologies and approaches, which innovatively proposes the concept of polymer 3D copying technology. It introduces the two technologies of polymer 3D printing and 3D copying by analogy and elaborates the core principles and processes of polymer 3D copying technology, the composition, basic parameters and structure design of polymer 3D copying machines, precision control methods, defect generation mechanism and solutions of polymer 3D copying products, and also discussed the future development of polymer 3D copying technology. The novel concept of 3D copying is one of the major features of the book, which is particularly suited for readers who are interested in rapid prototyping and molding. The book is based on both traditional and new knowledges, with novel content and concept, focusing on both principles and engineering practice. It systematically reflects the content and application of polymer 3D printing and 3D copying technology, which can benefit researchers, engineers, and students of related majors engaged in the fields of polymer processing, rapid prototyping, 3D printing and molding/ copying, etc.
Springer US Process Improvement in Practice
53.49 EUR
Faster, better and cheaper are challenges that IT-companies face every day. The customer's expectations shall be met in a world where constant change in environment, organization and technology are the rule rather that the exception. A solution for meeting these challenges is to share knowledge and experience - use the company's own experience, and the experience of other companies. Process Improvement in Practice - A Handbook for IT Companies tackles the problems involved in launching these solutions. Process Improvement in Practice - A Handbook for IT Companies is designed for small IT companies who wish to start with systematic improvement. The methods and techniques in this handbook are tried in practice, and have proven to be easy to use and scalable for local needs. Managers and developers will discover useful tips to initiate improvement work efficiently. This practical handbook is based on the authors' improvement work in a range of companies since the mid-nineties. Process Improvement in Practice - A Handbook for IT Companies is designed for a professional audience, composed of researchers and practitioners in industry. This book is also suitable for graduate-level students in software process improvement and software engineering.
Springer US Diffusing Software Product and Process Innovations
213.99 EUR
Diffusing Software Product and Process Innovations addresses the problems and issues surrounding successful diffusion of innovations in software. Everett Rogers' classic text, Diffusion of Innovations, provides a valuable framework for evaluating and applying technology transfer methods. In today's new economy, the most important innovations may well be new software products and processes. Topics covered in this valuable new book include: Implementation and coordination issues; New interpretations of diffusion theory; Diffusion of software processes; Contextual factors; Communication of information; Experience reports. This volume contains the edited proceedings of the Fourth Working Conference on Diffusing Software Product and Process Innovations, which was sponsored by the International Federation for Information Processing (IFIP) Working Group 8.6, and held in Banff, Canada in April 2001. It reflects the latest experiences of practitioners and theories of academics in this fast-changing field.
Springer US Value-Focused Business Process Engineering : a Systems Approach
42.79 EUR
One of the keys to successful business process engineering is tight alignment of processes with organisational goals and values. Historically, however, it has always been difficult to relate different levels of organizational processes to the strategic and operational objectives of a complex organization with many interrelated and interdependent processes and goals. This lack of integration is especially well recognized within the Human Resource Management (HRM) discipline, where there is a clearly defined need for greater alignment of HRM processes with the overall organizational objectives. Value-Focused Business Process Engineering is a monograph that combines and extends the best on offer in Information Systems and Operations Research/Decision Sciences modelling paradigms to facilitate gains in both business efficiency and business effectiveness.
Springer US Process Control Systems
53.49 EUR
Stratification of computer tasks 94 Example I 94 Example 2 96 Controllevels and computer input/output hardware 104 Leveli 105 Level 2 118 Level 3 118 Level4 118 Level5 119 Characteristics of process control computer systems 119 A survey of process control computer hardware 120 Communication codes and circuits 138 Channe1 capacity 138 Types of connection and communication hardware 140 Practical suggestions and recommendations 152 Rcferences 153 Part II: The Role of Software in Process Control Systems 155 Chapter 4: The relative roles of software and hardware 157 In troduction 157 Data processing 158 Hardware 159 Computingpower 163 Software for process control data processing 169 Process software 170 Intercomputer communication software 173 Message switching software 173 Software for engineering ca1culations 173 Extcnded real-time software 173 Software versus hardware 174 Program loop 175 References 183 Chapter 5: System software 185 Introduction 185 Basic concepts of real-time operating systems 186 Structure and functions of real-time operating systems 190 Data and symbols for the operating system 200 System software 204 Cost, safety and reliability of operating system software 208 References 209 Chapter 6: Application pro grams and databases 211 Introduction 211 Application program tasks 211 Structure and timing requirement of application programs 220 Direct communication 227 Multiprogramming constraints 228 Database and basic process software 233 Access to database 235 Basic faciJities of an on-line database 236 Database organization 240 Contention resolution 243 Distributed database 244 Extended real-time software 247 Referenees 257 Part III: The Man-Machine Interface 259
Springer US Predictive Process Control of Crowded Particulate Suspensions
695.49 EUR
Wisdom is the principal thing; therefore get wisdom; and with all thy getting, get understanding. Proverbs 4:7 In the early chapters of the book of Proverbs there is a strong emphasis on three words: knowledge, understanding, and wisdom. Perhaps we can apply these words to our philosophy behind the technology of Predictive Process Control. Knowledge is the accumulation of information provided by education as we begin to store the data in our brains that should prepare us for the challenges of the manufacturing environment. It applies to every level and every opportunity of education, formal and informal. This is simply to Know, without any requirement except a good memory, and is the basis for the following two thoughts. Understanding is the assimilation of knowledge, or the thinking process, as we begin to arrange and rearrange the data we Know for quick recall as it may be needed. This also applies to every level and opportunity of education. It is Know-Why based upon what we Know, and it requires some scepticism of oversimplified answers and a hunger for mental consistency. Wisdom is the application of both knowledge and understanding in real life enterprises. As we apply both our knowledge and understanding in those situations, all three are further enhanced by each progressive experience. This is that wonderful Know-How - to apply our education based upon Know-why, which was based upon Knowledge - which provides the confidence we need to advance in all phases of performance.
Springer US Predictive Process Control of Crowded Particulate Suspensions
695.49 EUR
Wisdom is the principal thing; therefore get wisdom; and with all thy getting, get understanding. Proverbs 4:7 In the early chapters of the book of Proverbs there is a strong emphasis on three words: knowledge, understanding, and wisdom. Perhaps we can apply these words to our philosophy behind the technology of Predictive Process Control. Knowledge is the accumulation of information provided by education as we begin to store the data in our brains that should prepare us for the challenges of the manufacturing environment. It applies to every level and every opportunity of education, formal and informal. This is simply to Know, without any requirement except a good memory, and is the basis for the following two thoughts. Understanding is the assimilation of knowledge, or the thinking process, as we begin to arrange and rearrange the data we Know for quick recall as it may be needed. This also applies to every level and opportunity of education. It is Know-Why based upon what we Know, and it requires some scepticism of oversimplified answers and a hunger for mental consistency. Wisdom is the application of both knowledge and understanding in real life enterprises. As we apply both our knowledge and understanding in those situations, all three are further enhanced by each progressive experience. This is that wonderful Know-How - to apply our education based upon Know-why, which was based upon Knowledge - which provides the confidence we need to advance in all phases of performance.